Crystallized condensate residues from a reflow soldering system

Everything has a unique molecular fingerprint. Even your product.

FT-IR analyses provide deep insights into the molecular structure of a material. At the same time, the specific molecular signature is as individual as a fingerprint. No spectrum is the same as another. From the smallest differences, by comparing seemingly identical material samples, additives, oxidative and thermal influences or impurities can be detected.

FT-IR analyses can do so much more than that. For example, they ensure the decisive competitive advantage in material selection during product development and reveal the material composition of competitor products.

In PCB production, for example, they allow the analysis of the crosslinking of a PCB substrate and thus prevent, for example, PCB distortion or outgassing of the PCB components during the soldering process. Both can occur if the PCBs are not completely or not homogeneously cross-linked during the production process. Excessive humidity absorption of the printed circuit board substrate can also disrupt the manufacturing process if it is not stored correctly and can lead to delamination during soldering process.

The outgassing in the soldering process can result not only in the formation of a persistent polymerized condensate layer, but also in the formation of crystalline residues. These residues often grow in the exhaust lines as well as in flow-calming areas and lead to irregular heat distribution in a soldering system and a significant shortening of maintenance intervals. Depending on their chemical composition, they remain as residue on the finished assembly after the cleaning process and can affect its quality negatively in the long term. FT-IR analyses help to detect uncrosslinked components of a PCB at an early stage and thus prevent these components from outgassing, polymerizing or crystallizing during the soldering process.

FT-IR analyses can be used to identify defects that remain hidden to conventional testing methods. Production and storage defects can be detected in just a few minutes. The analysis results are available to customers digitally immediately after the measurement. FT-IR material analyses support you in a resource-saving, smooth production process and help to significantly reduce additional costs, complaints and unnecessary waste.