Condensate formation in reflow soldering process
Crystalline condensate residue in reflow soldering process

What is absolutely essential on a cake can safely stay away in the soldering process. But what are the causes of such crystalline condensate residues? Are they the result of an incorrectly performed soldering process? Are they the result of serious quality deviations in the production process? Or are they the result of bad condensate management? Who or what is responsible when “crumbles” appear in the soldering system?

During the past years, we have intensively focused on the topic of condensate formation. We have analyzed numerous condensate residues at the molecular level and written several technical publications on this topic. There is a simple answer to the questions about the cause – there is not one responsible person and there is not one single cause. Condensation is a multi-step process and its formation and amount depend on the individual production and processing steps.

If increased condensate formation occurs in the soldering process, the cause can be identified with an FT-IR analysis of the condensate. The analytical partner plays a decisive role in the success or failure of the condensate analyses. The solution will not be provided by expensive databases filled to the brim with spectra. In most cases, the “source of error” is located  directly in front of the FT-IR spectrometer. Customers often tell us about FT-IR analyses purchased at excessively high prices without usable results, and this is really regrettable. At the end of the day, experience in electronics manufacturing and the essential knowledge of condensate formation processes are decisive for a successful analysis interpretation.

For all of you, who are interested in the topic “Condensate in the soldering process – causes, formation and growth mechanisms “, we offer trainings on this topic. Just send an email: . Of course we are also available for condensate analyses and any questions about condensate formation.